Technologies from A to Z

One of Altatec’s key strengths is expertise in the chIP-on-chip, chip-on-board and chip-on-ceramic fields. Below are just some of the process technologies in which Altatec specialises:

• Die and wire bonds

• Glob top encapsulants

• Flip chip

• SMDs

• Vacuum brazing

• Manual soldering

• Bonding

• Heat sealing

• Laser trimming (active / passive)

• Unit casting

• Function testing